What is Cu clip package? copper jewelry

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Power chips are linked to exterior circuits with packaging, and their performance depends on the support of the product packaging. In high-power situations, power chips are typically packaged as power modules. Chip affiliation refers to the electric link on the upper surface area of the chip, which is typically light weight aluminum bonding wire in traditional modules. ^ Traditional power component bundle cross-section

Today, business silicon carbide power modules still mainly use the packaging modern technology of this wire-bonded conventional silicon IGBT component. They encounter troubles such as large high-frequency parasitic specifications, not enough heat dissipation ability, low-temperature resistance, and inadequate insulation toughness, which restrict the use of silicon carbide semiconductors. The display of excellent efficiency. In order to resolve these problems and completely make use of the big potential advantages of silicon carbide chips, numerous brand-new packaging innovations and services for silicon carbide power modules have actually emerged in recent years.

Silicon carbide power module bonding approach

What is Cu clip package? copper jewelry插图

(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)

Bonding materials have developed from gold wire bonding in 2001 to light weight aluminum cord (tape) bonding in 2006, copper cable bonding in 2011, and Cu Clip bonding in 2016. Low-power devices have actually established from gold cords to copper cords, and the driving force is cost decrease; high-power gadgets have actually established from aluminum cables (strips) to Cu Clips, and the driving pressure is to enhance item performance. The better the power, the greater the needs.

Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a packaging process that makes use of a solid copper bridge soldered to solder to attach chips and pins. Compared with standard bonding packaging approaches, Cu Clip technology has the following benefits:

1. The connection in between the chip and the pins is made of copper sheets, which, to a particular degree, changes the conventional cable bonding approach between the chip and the pins. Consequently, an unique plan resistance value, greater current circulation, and far better thermal conductivity can be gotten.

2. The lead pin welding area does not require to be silver-plated, which can fully conserve the cost of silver plating and inadequate silver plating.

3. The product appearance is entirely regular with normal items and is generally made use of in servers, mobile computer systems, batteries/drives, graphics cards, motors, power products, and various other areas.

Cu Clip has two bonding approaches.

All copper sheet bonding approach

Both eviction pad and the Resource pad are clip-based. This bonding method is a lot more costly and complicated, but it can achieve better Rdson and much better thermal results.

What is Cu clip package? copper jewelry插图1

( copper strip)

Copper sheet plus cable bonding technique

The resource pad uses a Clip technique, and eviction makes use of a Cable technique. This bonding technique is slightly less expensive than the all-copper bonding approach, saving wafer location (applicable to extremely small gate areas). The procedure is simpler than the all-copper bonding method and can obtain far better Rdson and much better thermal impact.

Supplier of Copper Strip

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