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Sputtering target manufacturers produce sputtering targets in all popular geometries, including circular, rectangular, ring, delta, conical, & custom configurations. They also offer vacuum melted, e-beam melted & hot pressed materials in various compositions.
Sputtering targets are used to produce thin films of metals, alloys, oxides, nitrides, carbides, fluorides, cermets, intermetallics, & transparent conductive oxides for semiconductor, display, optical & energy applications. They can be used for coating a substrate or for etching or chemical vapor deposition of thin film layers on other components.
The sputtering process is performed by placing the target material into a chamber, where it is exposed to an inert gas such as oxygen. The sputtered target material is vaporized in the inert gas creating a thin film. The sputtering target can be produced using an induction melting (VIM) or a laser annealing method to achieve high purity, sputtering power, and uniformity.
Several sputtering target compositions can be used with the same gas mixture to obtain different microstructures and film properties. The sputtered target is characterized by its X-ray diffraction pattern, which reflects the crystallographic phase structure of the deposited film.
A sputtering target is a solid slab of a desired shape that is used as an sputtering source for deposition of thin film material on a substrate. The target can be of pure metals, or alloys containing other elements.
This sputtering target can be of any desired metal or alloy, including scandium, titanium, vanadium, cobalt, nickel, copper, zinc, gallium, manganese, chromium, molybdenum, niobium, tin, gold, silver, tungsten, rhenium, osmium, iridium, platinum, and lanthanum.